Method for making an electrically conducting mechanical interconnection member
US8178416B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 24, 2008 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Dec 16, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating an electrically conductive mechanical interconnection element (12) comprises: a first stage of electrochemically depositing a structure comprising a plurality of metal wires (2a) of sub-micrometric diameter projecting from the likewise metallic surface of a substrate (2); and a second stage of controlled partial dissolution of said wires to reduce their diameter. A method of making a mechanical and/or electrical interconnection, the method comprising the steps consisting in: fabricating two interconnection elements by a method as described above; and placing said interconnection elements face to face and pressing one against the other so as to cause the nanometric wires projecting from the surfaces of said elements to interpenetrate and tangle together. A three-dimensional electronic device comprising a stack of microelectronic chips mechanically and electrically connected to one another by such interconnection elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.