Polyoxyalkylene polyamide-glycidyl ether adduct epoxy resin curing agent
US8178598B2 · kind B2 · utility
11Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2007 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Dec 17, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curing agent for epoxy resin, and a coating composition using the curing agent curing agent that delivers excellent recoatability and overcoatability after a long time exposure. Coating composition comprising the epoxy curing agent of the above described A or B.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.