Light emitting diode package structure
US8178890B2 · kind B2 · utility
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1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2009 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Feb 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
Abstract
A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.