High power LED module assembly and method for manufacturing the same
US8179037B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2009 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Dec 31, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high power LED module assembly may include at least one high power LED module each of which includes a MCPCB and a high power LED disposed on the MCPCB, a flex tube which includes a base engaging with each of the high power LED modules and a cover enclosing the base; wherein the high power LED module assembly further comprises at least one heat sink each of which is correspondingly connected to the bottom of each high power LED modules; and wherein the cover is engaged with the heat sink and encloses the base, the high power LED module and all other sides of the heat sink than the bottom side thereof which is exposed to ambient environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.