Low cost integrated antenna assembly and methods for fabrication thereof
US8179323B2 · kind B2 · utility
7Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2008 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Jan 8, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A conductive layer is applied to a thermoformed plastic component to form an integrated antenna assembly. The conductive layer is on a flexible layer and adhered or attached to the rigid thermoformed plastic carrier. Features are designed into the thermoformed plastic carrier to provide electrical contacts from the conductive layer to the circuit board of the communication device and to mechanically attach the carrier to the circuit board. Multiple conductive layers can be applied to a multi-layered thermoformed structure to form a multi-antenna assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.