Antennas using chip-package interconnections for millimeter-wave wireless communication
US8179333B2 · kind B2 · utility
6Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 2009 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Aug 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A compact millimeter-wave transmitter and receiver make use of interconnections within a chip-containing package for providing an integrated antenna. Due to shorter wavelength of millimeter-waves, these interconnections can be used as antennas for radiation of electromagnetic waves. A dielectric cover or lens is provided within the package to increase the antenna's directivity and to provide a mechanical shield for the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.