Imaging apparatus for electronic endoscope and electronic endoscope
US8179428B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2005 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Aug 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/555
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imaging apparatus for an electronic endoscope includes a bare chip of CCD, a circuit board with approximately the same thickness as the bare chip, and a conducting plate with no less than 1/4 width of the bare chip. The bare chip has terminals on the surface with an imaging surface. The terminals are arranged near the edge facing the rear end of an insertion section of the electronic endoscope. The circuit board has terminals on the surface near the edge facing the front end of the insertion section. These terminals are connected by wire bonding. The conducting plate is attached along one side of the rear surface of the CCD and the circuit board for electrical connection. A forceps channel is provided such that its outer circumference fits partially into a cut portion formed on the rear surfaces of the CCD and the circuit board by the conducting plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.