Optical interconnects in cooling substrates
US8179676B2 · kind B2 · utility
4Cited by
23References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2010 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Nov 18, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8586
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of PCBs with free-space optical bearers. Since cooling components such as fans and heat sinks are no longer required on the PCB, the PCB is thinner and makes better use of a cooling substrate by also using it to carry optical signals. A card or a backplane supporting a plurality of active components can combine optical signals and cooling aspects in support of those components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.