System and method for performing thermal analysis on a building through universal meshing
US8180598B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | Feb 10, 2009 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Feb 12, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2111/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A universal mesh for a building insulation model is established from a template representing a wide range of insulation profiles, with the mesh being used for conducting one, two or three-dimensional finite element analysis (FEA) regarding thermal insulation factors for the building. The system and method take into account a wide range of heat related factors, including structural materials of the building, insulation components encompassing both insulation materials employed in the building process and established air pockets or gaps, and even fasteners used in the construction process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.