Input/output buffer information specification (IBIS) model generation for multi-chip modules (MCM) and similar devices
US8180600B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2006 |
| Grant date | May 15, 2012 |
| Priority date | — |
| Expiry date | Mar 2, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/367
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the invention is a method for modeling electrical behavior of a packaged module having multiple integrated circuits (ICs), such as a multi-chip module (MCM). The method includes: (a) identifying one or more pin groups in the module, wherein a pin group comprises two or more buffers connected together and to a package-external pin, and (b) generating one or more corresponding unified behavioral models for the one or more pin groups based on the characteristics of the buffers of the one or more pin groups. The behavioral models are part of an integrated behavioral model file in accordance with the I/O buffer information specification (IBIS) standard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.