Electronic component mounting method
US8181337B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2009 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Oct 7, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.