Power semiconductor module with prestressed auxiliary contact spring
US8182273B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 19, 2009 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Jan 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor module having a housing, a pressure member, a substrate including at least one contact surface, and at least one connection element leading towards the exterior of the housing. The connection element has a first contact device, a resilient section and a second contact device. The pressure member has two stop elements. The first contact device is electrically conductively connected to the contact surfaces of the substrate. The second contact device is arcuate in shape and has at least one deformation at the beginning and at the end of the arc, wherein, as a result of the deformations of the second contact device co-operating with the two stop elements of the pressure member, the connection element is prestressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.