Method for texturing silicon wafers for producing solar cells

US8182706B2 · kind B2 · utility

Assignee

• University of Konstanz · DE

Inventors

• Peter Fath · Ilsenburg, DE
• Ihor Melnyk · Horlivka, UA
• Eckard Wefringhaus · Ilsenburg, DE

Key dates

• Filing date: Jul 12, 2007
• Grant date: May 22, 2012
• Expiry date: Sep 7, 2028

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

In a method for texturing silicon wafers for producing solar cells, the step of introducing a silicon wafer involves the use of a texturing solution which is at a temperature of at least 80 degrees Celsius and which comprises water admixed with 1 percent by weight to 6 percent by weight KOH or 2 percent by weight to 8 percent by weight NaOH and with a surfactant or a surfactant mixture constituting less than 0.01 percent by weight. Very economic texturing can be performed in this way.