Laminated ceramic package
US8182904B2 · kind B2 · utility
0Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2008 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Dec 5, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a laminated ceramic package. The laminated ceramic package includes a laminated ceramic substrate having a conductive pattern therein, a first ceramic layer on the laminated ceramic substrate, and a second ceramic layer on the first ceramic layer. The first ceramic layer has a firing area shrinkage rate of about 1% or less. The second ceramic layer has a cavity receiving electronic components and a different firing shrinkage rate from the first ceramic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.