Conductive paste and mounting structure using the same
US8182923B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2009 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Aug 22, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.