Film forming additive formulations of conductive polymers
US8183319B2 · kind B2 · utility
3Cited by
9References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2008 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Feb 21, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An aqueous dispersion including a partially fluorinated dispersant, an electrically conductive polymer and a film forming additive. The film forming additive includes a boiling temperature greater than about 85° C. (185° F.). In addition, the concentration of the film forming additive is less than the solubility limit of the additive in water. The dynamic surface tension of the dispersion including the film forming additive is less than about 60 dynes/cm at 100 ms surface age. A method for making an electrically conductive polymer film and devices including electrically conductive polymer film are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.