Thermosetting compound, composition containing the same, and molded article
US8183368B2 · kind B2 · utility
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3Claims
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Key dates
| Filing date | Aug 3, 2006 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Sep 5, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/0233
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The object of the present invention is to provide a thermosetting compound having dielectric properties, in particular permittivity and dielectric loss, which are improved compared to prior art, a composition containing the same, and a molded article. The thermosetting compound according to the present invention is a dihydro benzoxazine compound represented by the following Formula (2),where, R6 to R13 represent a hydrogen atom, an alkyl group, or the like, and R14 represents a divalent saturated alicyclic hydrocarbon group having a condensed ring structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.