Component built-in wiring substrate and manufacturing method thereof
US8183465B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2009 |
| Grant date | May 22, 2012 |
| Priority date | — |
| Expiry date | Nov 24, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10712
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component built-in wiring substrate (10) which includes: a core substrate (11); a plate-shaped component (101); a resin filling portion (92); and a wiring stacking portion (31), wherein, when viewed from the core principal surface (12) side, the projected area of the mounting area (32) is larger than the projected area of the plate-shaped component (101) and the resin filling portion, and the plate-shaped component and the resin filling portion are positioned directly below the mounting area (23), and wherein a value of the coefficient of thermal expansion (CTE α2) for a temperature range that is equal to or higher than the glass transition temperature of the resin filling portion is set to be larger than a value of the coefficient of thermal expansion of the plate-shaped component and smaller than a value of the coefficient of thermal expansion of the core substrate for the subject temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.