Pressure sensor with on-board compensation
US8186226B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 9, 2009 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Nov 29, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/065
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure relates generally to pressure sensors, and more particularly, to methods and apparatus for compensating pressure sensors for stress, temperature and/or other induced offsets and/or errors. In one illustrative embodiment, a pressure sensor may include a pressure sensing die mounted to a substrate of a pressure sensor package. The pressure sensor die may include on-board compensation. In some instances, the on-board compensation may include an on-board heating element and an on-board zener diode trim network, both situated on or in the pressure sensing die. The zener diode trim network may include one or more zener diodes and one or more resistive elements, where the zener diodes can be selectively activated to “trim” the resistive network to compensate for one or more offsets and/or errors of the pressure sensor. The on-board heating element may be configured to heat the pressure sensor assembly to various temperatures so that temperature related offsets and/or errors may be identified, and then compensated for with the zener diode trim network.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.