Heat dissipating material and semiconductor device using same
US8187490B2 · kind B2 · utility
6Cited by
25References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2007 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Dec 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.