Material application method
US8187668B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2008 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Mar 31, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A stage on which a substrate having target discharge areas is placed moves relative to a discharge head unit. When at least one of a plurality of first discharge nozzles of the discharge head unit reaches one of the target discharge areas, the first nozzle discharges a first droplet of fluid material to the target discharge area. When one of a plurality of second nozzles of the discharge head unit reaches the target discharge area to which the first droplet has been discharged, the second nozzle discharges a second droplet of the fluid material to the target discharge area. A first nozzle row of the first nozzles and a second nozzle row of the second nozzles are separated by a predetermined distance in a direction of the relative movement of the stage and the discharge head unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.