Circuit materials, circuits laminates, and method of manufacture thereof
US8187696B2 · kind B2 · utility
14Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2009 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Jul 17, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/257
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.