Solder structures for fabrication of inverted metamorphic multijunction solar cells
US8187907B1 · kind B1 · utility
35Cited by
36References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 7, 2010 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Oct 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/959
Abstract
A method of manufacturing a solar cell by providing a first substrate; depositing on the first substrate a sequence of layers of semiconductor material forming a solar cell including a top subcell and a bottom subcell; forming a metal back contact over the bottom subcell; forming a group of discrete, spaced-apart first bonding elements over the surface of the back metal contact; attaching a surrogate substrate on top of the back metal contact using the bonding elements; and removing the first substrate to expose the surface of the top subcell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.