Method of joining and method of fabricating an organic light emitting diode display device using the same
US8187960B2 · kind B2 · utility
2Cited by
16References
8Claims
0Family size
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Key dates
| Filing date | Sep 7, 2011 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Sep 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of joining a flexible layer and a support includes forming a first metal layer on one surface of the flexible layer, forming a second metal layer on one surface of the support, cleaning the first metal layer and the second metal layer, and joining the first metal layer to the second metal layer, such that the first metal layer is between the flexible layer and the second metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.