Flex-rigid printed wiring board and manufacturing method thereof
US8188372B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 21, 2006 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Aug 18, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board.The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf<tR.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.