Insulating layer for rigid printed circuit boards
US8188373B2 · kind B2 · utility
6Cited by
20References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2008 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Nov 8, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.