Printed wiring board and method for manufacturing printed wiring board
US8188380B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2009 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Jun 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49213
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board and a method for manufacturing the same are provided. The printed wiring board includes a resin insulation layer having a first surface and a second surface opposite the first surface, and includes an opening for a first via conductor. An electronic-component mounting pad is formed on the first surface of the resin insulation layer. The electronic-component mounting pad includes a portion embedded in the resin insulation layer and a portion protruding from the resin insulation layer. The protruding portion covers the embedded portion and a portion of the first surface of the resin insulation layer that surrounds the embedded portion. A first conductive circuit is formed on the second surface of the resin insulation layer. A first via conductor is formed in the opening of the resin insulation layer and connects the electronic-component mounting pad and the first conductive circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.