Fabrication of three-dimensional ion optics assemblies by metallization of non-conductive substrates
US8188422B1 · kind B1 · utility
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Key dates
| Filing date | Feb 4, 2010 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Dec 24, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J49/0018
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A die assembly for creating a ring electrode including a cylindrically-shaped die base, two die walls and a die top sized to fit inside a cylindrical die housing. The die base and die top having a series of concentric elevations used as impressions to form on two ends of the ring electrode. A method of fabricating an LTCC ring electrode using the die assembly is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.