RF powder and method for manufacturing the same
US8188924B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 22, 2008 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Apr 5, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07767
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides an RF powder having a characteristic to be used as a powder (powdery substance) which is composed of a large quantity of particles and has a collective form, wherein each of a large quantity of particles composing the powder is smaller in size as compared with a current IC tag chip and is used as a device having a function substantially equivalent to the IC tag chip, use form thereof is not individual device use but powder use, treatment is easy, a manufacturing cost is very low in respect of a unit cost of each particle, and a practical use is very high, and a method for manufacturing the same. An RF powder 11 is used in a powder form, wherein each particle 11a in the powder has an integrated circuit 13 formed on a substrate 12, an insulating layer 14 formed on the integrated circuit, and an antenna element 15 formed on the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.