Image pick-up module and method for assembling such an image pick-up module
US8189062B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2008 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Jan 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/555
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image pick-up module comprises an electronic image sensor, single-piece circuit board electrically bonded to the image sensor, and at least one cable electrically bonded and leading away from the circuit board. The circuit board has at least three sections, first and second section extending in relation to the other and obliquely or crosswise to the image sensor, and third section arranged between first and second section. The image sensor is arranged on the circuit board opposite the third section. In a method for assembling the image pick-up module, the circuit board has the form of a planar board blank comprising at least three sections folded along flexible connecting sections whereby the at least one cable is bonded to the board, and the board folds whereby a third section is located between first and second section, and the image sensor is bonded to the circuit board opposite the third section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.