Digital camera having double housing construction for heat dissipation, high rigidity, and reduced tactile temperature
US8189098B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2009 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Apr 30, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03B17/55
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In order to provide a digital camera which includes a heat dissipating device which can cool sufficiently a solid state image pick-up device and integrated circuits, which has a high rigidity and which affects little the design of the digital camera, there is provided a digital camera comprising a lens unit 15, a solid state image pick-up device 31 and integrated circuits 41, wherein a camera housing is made to have a double housing construction by an outer housing 11 which is formed of a member having a low thermal conductivity and an inner housing 61 which is formed of a member having a high rigidity and a high thermal conductivity, wherein a heat dissipating space is defined between the outer housing 11 and the inner housing 61, the integrated circuits 41 configuring a heat source and the inner housing 61 are connected together by a member having a high thermal conductivity, and wherein the inner housing 61 is made up of a main body side housing which is situated in the vicinity of the solid state image pick-up device 31 and the integrated circuits 41 and a lens side housing 62 which covers a circumferential edge of the lens unit 15, whereby heat is dissipated from the whole sur…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.