Power electronic assembly with slotted heatsink
US8189324B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 7, 2009 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Dec 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.