Thermal management systems and methods
US8189331B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 25, 2010 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | Oct 5, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces. At least one first aperture in fluid communication with the chamber can be disposed on the second surface, while at least one second aperture in fluid communication with the chamber can be disposed on the first surface. A fluid mover, having a fluid inlet and a fluid discharge, can be disposed proximate the second aperture. Fluid from the chamber can provide an inflow to the fluid inlet and an outflow from the fluid discharge can be directed to the exterior of the electronic enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.