Methods and software for printing materials onto a substrate
US8191018B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2008 |
| Grant date | May 29, 2012 |
| Priority date | — |
| Expiry date | May 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/12
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and software for correcting printable circuit layouts. The methods generally including steps of identifying shapes in an input circuit layout, applying a plurality of correction rules to the shapes, and producing an output printed circuit layout in accordance with the identified shapes and the correction rules. The input circuit layout generally comprises a bitmapped image or other description of at least one printable layer of at least one electronic component, device, or die. Embodiments of the present invention further allow for more precise control of spreading and effective coverage of features (e.g., source/drain terminal regions, gates, capacitors, diodes, interconnects, etc.) on a substrate by a printed ink composition including electronic materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.