Method for laying floor panels
US8191334B2 · kind B2 · utility
72Cited by
7References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 24, 2009 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Jun 24, 2029 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F2201/0153
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A method for laying floor panels in a room to form a closed floor area on a laying plane (R) without using an adhesive. The floor panels especially comprising a wood material, such as MDF or HDF, and having matching corresponding profiles on opposite longitudinal edges (I, I′) and transverse edges (II, II′). The closed floor area is obtained by interconnecting a plurality of panels on their transverse edges (II, II′) to give a row (R1) and on their longitudinal edges (I,I′) to give a plurality of rows (Rn) and then locking them in relation to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.