Method for attaching porous metal layer to a metal substrate
US8191760B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2011 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Feb 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49861
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.