Adhesive layer composition for in-mold decoration
US8192837B2 · kind B2 · utility
2Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2008 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Dec 31, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31801
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration. This invention also relates to in-mold decoration tape or strip, comprising: a carrier layer; a release layer; a durable layer; and an adhesive layer which comprises an adhesive binder, a polymeric particulate material and an inorganic particulate material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.