Patent · US Active

Method for bonding layers, corresponding device and organic light-emitting diode

US8193070B2 · kind B2 · utility

0Cited by

5References

17Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Vincent Grolier · Birkenfeld, DE
Andreas Plössl · Regensburg, DE
Marianne Renner · Munich, DE

Key dates

Filing date	Sep 22, 2006
Grant date	Jun 5, 2012
Priority date	—
Expiry date	Jun 23, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31678

Abstract

A method for bonding several layers, which comprise at least one thermally bondable material, by means of a joint layer produced with the aid of thermocompression at least one of the layers comprising a semiconductor material, as well as to a correspondingly manufactured device. Also disclosed is a method for manufacturing an organic light-emitting diode and an organic light-emitting diode that is encapsulated between two cover layers with the aid of thermocompression.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.