Silicone resin composition for optical semiconductor devices and an optical semiconductor device
US8193269B2 · kind B2 · utility
2Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2010 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Jan 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Silicone resin composition for optical semiconductor devices, providing cured product wherein warpage in the devices is reduced and whiteness, heat-resistance, and light resistance are improved. The composition comprises: (A) an organopolysiloxane of the formula(CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2 (1)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.