Metal-clad laminates having improved peel strength and compositions useful for the preparation thereof
US8193274B2 · kind B2 · utility
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49Claims
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Inventors
Key dates
| Filing date | Aug 1, 2008 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Apr 5, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.