SMD diode holding structure and package thereof
US8193540B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2009 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Feb 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An SMD diode holding structure includes a plastic housing and a plurality of metal holders. Two ends of the plastic housing from a function area and a notch. The metal holder has a base portion and a connecting pin portion. The top and bottom surfaces of the base portion are exposed to the function area and the notch. The top surface of one base portion in the function area is connected with an LED chip, and the bottom surface of another base portion in the notch is connected with the anti-ESD chip. The LED chip, the anti-ESD chip, and the base portion are connected with a conductive wire. The function area is covered with a first sealing compound, and the notch is covered with a second sealing compound. Light emitted from the LED chip is uniformly reflected in the function area, and the brightness is uniform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.