Monolithic semiconductor switches and method for manufacturing
US8193559B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2011 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Apr 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One aspect is monolithic semiconductor switches and method for manufacturing. One embodiment provides a semiconductor die with a first n-type channel FET and a second n-type channel FET. A source of the first n-type channel FET and a drain of the second n-type channel FET are electrically coupled to at least one contact area at a first side of the semiconductor die, respectively. A drain of the first n-type channel FET, a gate of the first n-type channel FET, a source of the second n-type channel FET and the gate of the second n-type channel FET are electrically coupled to contact areas at a second side of the semiconductor die opposite to the first side, respectively. The contact areas of the drain of the first n-type channel FET, of the gate of the first n-type channel FET, of the source of the second n-type channel FET and of the gate of the second n-type channel FET are electrically separated from each other, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.