Micro-electro-mechanical systems (MEMS) package
US8193596B2 · kind B2 · utility
6Cited by
7References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2008 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Apr 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micro-electro-mechanical systems (MEMS) package includes a MEMS microphone device. The MEMS microphone device has a first substrate and at least a sensing element on the first substrate wherein a first chamber in the MEMS microphone device is connected to the sensing element. A second substrate is disposed over the MEMS microphone device to provide a second chamber in the second substrate over the sensing element opposite to the first chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.