Heat conductive sheet and method for producing same, and powder module
US8193633B2 · kind B2 · utility
5Cited by
10References
7Claims
0Family size
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Key dates
| Filing date | Sep 12, 2008 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Mar 28, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.