Transmitting radio frequency signal in semiconductor structure
US8193880B2 · kind B2 · utility
2Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2008 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Apr 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device for transmitting a radio frequency signal along a signal line includes a signal line that extends along a principal axis. On one side of the signal line is a first dielectric, and on the opposite side of the signal line is a second dielectric. First and second ground lines are proximate to the first and second dielectrics, respectively, and the ground lines are approximately parallel to the signal line. The device has a transverse cross-section that varies along the principal axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.