Electronic component and method of manufacturing same
US8193894B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2010 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Apr 1, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component capable of obtaining a large inductance value and a high Q value and a method of manufacturing the electronic component are provided. A coil includes a plurality of coil conductors incorporated in a multilayer structure, a plurality of lands provided at the plurality of coil conductors, and a via-hole conductor connecting the plurality of lands. Lead-out conductors are incorporated in the multilayer structure and connect the coil and external electrodes. The plurality of coil conductors form a substantially rectangular loop path in plan view from the z-axis direction by overlapping each other. The plurality of lands protrude toward outside the path at a short side of the path and do not overlap the lead-out conductors in plan view from the z-axis direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.