Suspension assembly with molded structures
US8194351B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2005 |
| Grant date | Jun 5, 2012 |
| Priority date | — |
| Expiry date | Nov 3, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4833
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A support assembly includes a base layer, a circuit defined along the base layer, and a first material molded on at least a portion of the base layer. The first material substantially forms a shape of at least a portion of the support assembly. Further disclosed is a molded suspension assembly. The molded suspension assembly includes a thin and elongate metallic substrate and a non-metallic material molded along at least a portion of one side of the metallic substrate. The non-metallic material interlocks with the metallic substrate. The molded suspension assembly includes a transducer support area at or near a first end of the molded suspension assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.