Layered image assembly
US8196324B2 · kind B2 · utility
1Cited by
13References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2007 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Nov 4, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09F2003/0285
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A layered assembly includes a first adhesive layer and a protective top layer affixed permanently on all sides to the first adhesive layer. The assembly also includes a first image layer onserted between the first adhesive layer and the protective top layer, wherein the protective top layer is provided over the first image layer and at least a portion of the protective top layer can be removed to reveal the first image layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.