Patent · US Active

3-dimensional curved substrate lamination

US8196636B2 · kind B2 · utility

8Cited by
24References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 23, 2010
Grant dateJun 12, 2012
Priority date
Expiry dateJul 23, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/18
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method of laminating a surface of a flexible material to a surface of a rigid, curved material. The method includes pressing an area of the surface of the flexible material into the surface of the rigid, curved material with a holder to create a contact area while the flexible material is conformed to the holder, which has a curvature greater than a curvature of the rigid, curved material surface; and changing the contact area between the surface of the flexible material and the surface of the rigid, curved material while maintaining pressure on the contact area until the surface of the flexible material and the surface of the rigid curved material are laminated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.