Electronic component mounting module and electrical apparatus
US8197099B2 · kind B2 · utility
3Cited by
7References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2009 |
| Grant date | Jun 12, 2012 |
| Priority date | — |
| Expiry date | Apr 20, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides an electronic component mounting module capable of increasing the adhesion between the board and the heat radiating member, improving the thermal conductivity, and effectively radiating heat generated from the LEDs being an electronic component. The LEDs are mounted on the surface of the ceramics board, and the rear surface 1b side of the board is disposed at the heat radiating member. A metallic fine particle layer having high thermal conductivity and flexibility is made to intervene between the board and the heat radiating member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.